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HSDL-7001-2500 Datenblatt und Spezifikationen

Hersteller : HP 

Verpacken : SOIC 

Pins : 16 

Temperatur : Min -40 °C | Max 85 °C

Größe : 142 KB

Application : IR 3,16 encode, decode IC 

HSDL-7001-2500 PDF-Download