Path:OKDatasheet > Halbleiter Datenblatt > National Semiconductor Datenblatt > GL-266P-70-2.9
GL-266P-70-2.9 spec: Geode Processor Integrated x86 Solution with MMX Support
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GL-266P-70-2.9 Datenblatt und Spezifikationen
Hersteller : National Semiconductor
Verpacken : PGA
Pins : 320
Temperatur : Min 0 °C | Max 0 °C
Größe : 4504 KB
Application : Geode Processor Integrated x86 Solution with MMX Support
GL-266P-70-2.9 PDF-Download
