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MG63PB30 spec: 0.25mm embedded DRAM/Customer Structured Array
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MG63PB30 Datenblatt und Spezifikationen
Hersteller : OKI
Verpacken : BGA
Pins : 352
Temperatur : Min -40 °C | Max 85 °C
Größe : 293 KB
Application : 0.25mm embedded DRAM/Customer Structured Array
MG63PB30 PDF-Download