Path:OKDatasheet > Halbleiter Datenblatt > Power Innovations Datenblatt > TISP3072F3D
TISP3072F3D spec: Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
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TISP3072F3D Datenblatt und Spezifikationen
Hersteller : Power Innovations
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Temperatur : Min 0 °C | Max 0 °C
Größe : 456 KB
Application : Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
TISP3072F3D PDF-Download