P0408FC3.3C spec: 3.3V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards

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P0408FC3.3C Datenblatt und Spezifikationen

Verpacken : SOIC

Pins : 16

Temperatur : Min -55 °C | Max 150 °C

Größe : 203 KB

Application : 3.3V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards