5962H9475403QLA spec: Radiation Hardened PAL SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.

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5962H9475403QLA Datenblatt und Spezifikationen

Hersteller : UTMC

Verpacken : DIP

Pins : 24

Temperatur : Min -55 °C | Max 125 °C

Größe : 315 KB

Application : Radiation Hardened PAL SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.