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XQV600-4CB228M Datenblatt und Spezifikationen

Hersteller : Xilinx 

Verpacken : Ceramic QFP 

Pins : 228 

Temperatur : Min -55 °C | Max 125 °C

Größe : 278 KB

Application : QPro Virtex 2.5V QML high-reliability FPGA. 

XQV600-4CB228M PDF-Download