Path:OKDatasheet > Halbleiter Datenblatt > NEC Datenblatt > TESVSP0J335M8R
TESVSP0J335M8R spec: Resign molded chip ultra miniaturized
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TESVSP0J335M8R Datenblatt und Spezifikationen
Hersteller : NEC
Verpacken : P CASE
Pins : 0
Temperatur : Min 0 °C | Max 0 °C
Größe : 136 KB
Application : Resign molded chip ultra miniaturized
TESVSP0J335M8R PDF-Download