Path:OKDatasheet > Halbleiter Datenblatt > Power Innovations Datenblatt > TISP3250H3SL
TISP3250H3SL spec: Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
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TISP3250H3SL Datenblatt und Spezifikationen
Hersteller : Power Innovations
Verpacken : SL
Pins : 0
Temperatur : Min 0 °C | Max 0 °C
Größe : 254 KB
Application : Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
TISP3250H3SL PDF-Download