TSB12LV01AIPZ spec: HIGH PERFORMANCE 3.3V LINK LAYER WITH 32-BIT HOST I/F, 2K FIFOS

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TSB12LV01AIPZ Datenblatt und Spezifikationen

Hersteller : TI

Verpacken : PZ

Pins : 100

Temperatur : Min -40 °C | Max 85 °C

Größe : 293 KB

Application : HIGH PERFORMANCE 3.3V LINK LAYER WITH 32-BIT HOST I/F, 2K FIFOS