TSB12LV01APZ spec: "HIGH PERFORMANCE 3.3V LINK LAYER WITH 32-BIT HOST I/F, 2K FIFOS"

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TSB12LV01APZ Datenblatt und Spezifikationen

Hersteller : TI

Verpacken : PZ

Pins : 100

Temperatur : Min 0 °C | Max 0 °C

Größe : 293 KB

Application : "HIGH PERFORMANCE 3.3V LINK LAYER WITH 32-BIT HOST I/F, 2K FIFOS"